A major advancement in microcontroller technology has been introduced by Renesas Electronics Corporation, a leading provider of semiconductor solutions. The newly launched RA4L1 microcontroller (MCU) group comprises 14 innovative devices designed for ultra-low power consumption, enhanced security, and segment LCD support. Built on an 80-MHz Arm Cortex-M33 processor with TrustZone capability, these MCUs have been tailored to meet the needs of various applications, including water meters, smart locks, and IoT sensors.

To optimize power efficiency, proprietary low-power technology has been employed in the RA4L1 MCUs. With an active mode consumption of just 168 µA/MHz at 80 MHz and a standby current of only 1.70 µA while retaining all SRAM, these MCUs set new benchmarks in energy efficiency. Additionally, their availability in ultra-compact packages, such as a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), ensures suitability for portable printers, digital cameras, and smart labels.

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Developers are supported by Renesas’ Flexible Software Package (FSP), which simplifies application development by offering essential infrastructure software. This includes multiple RTOS options, BSP, peripheral drivers, middleware, networking capabilities, and TrustZone support. Moreover, FSP facilitates seamless integration of legacy code and enables smooth migration to and from RA6 or RA2 Series devices, ensuring greater flexibility for developers.

According to Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas, the RA4L1 Group has been developed in response to customer demands for ultra-low power solutions with enhanced CPU performance, segment LCD capabilities, and advanced security. The success of the RA2L1 Group MCUs since their introduction in 2020 has driven the expansion of this innovative lineup.

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Key Features of the RA4L1 MCUs:

  • Core: 80 MHz Arm Cortex-M33 with TrustZone
  • Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash
  • Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
  • Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100
  • Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash
  • Temperature Range: -40º to +125º C for QFN, QFP, and CSP packages; -40º to +105º C for BGA packages

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Availability

The RA4L1 MCUs, along with the FSP software, are now available. Additionally, an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK) have been released. More details, including ordering options, can be found at renesas.com/RA4L1.

Renesas’ MCU Expertise

As a global leader in microcontroller technology, Renesas delivers over 3.5 billion MCUs annually. While nearly 50% of these shipments cater to the automotive sector, the remainder supports industrial, IoT, data center, and communications applications. Renesas’ extensive portfolio spans 8-bit, 16-bit, and 32-bit devices, offering unmatched performance and reliability. With a trusted reputation built over decades, the company’s advanced production technology and strong ecosystem of over 250 partners further reinforce its industry leadership. More information about Renesas MCUs can be found at renesas.com/MCUs.

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